Presented at DesignCon 2009
When designing links, SI engineers often begin with a specific connector platform and then modify system variables such as trace length, dielectric materials, and equalization settings to achieve acceptable performance.
This paper takes a different approach by setting various system and equalizer parameters to slightly aggressive values and then studying the effect of various connector performance levels.
The result of the paper is a set of connector performance guidelines that can be referenced in order to design 25 Gbps backplane systems successfully.
Download this whitepaper to learn more.
Read More
By submitting this form you agree to TE Connectivity contacting you with marketing-related emails or by telephone. You may unsubscribe at any time. TE Connectivity web sites and communications are subject to their Privacy Notice.
By requesting this resource you agree to our terms of use. All data is protected by our Privacy Notice. If you have any further questions please email dataprotection@techpublishhub.com
Related Categories: Communication, Components, Connectors, Industrial
More resources from TE Connectivity
Application of Full-wave 3D Field Solvers to Predict EMI Behavior in SFP Cages
This paper presents an investigation into the usage of modeling techniques to predict and improve the shielding effectiveness of rectangular, metal...
CHOOSING THE RIGHT TYPE OF ACCELEROMETER
As with most engineering activities, choosing the right tool may have serious implications on the measurement results. The information below may he...
Micro ACTION PIN Compliant-Pin Connectors: Advancing the State of the Art in Press-Fit Technology
Micro ACTION PIN (MAP) connectors from Tyco Electronics have taken through-hole connector technology to a new level— significantly reducing hole ...