Latest resources from TE Connectivity
Application of Full-wave 3D Field Solvers to ...
This paper presents an investigation into the usage of modeling techniques to predict and improve the shielding effectiveness of rectangular, metal...
KOAXXA SMA RF Interconnects Innovation & Tech...
This white paper presents a technical overview of TE Connectivity's (TE) new KOAXXA SMA RF interconnect product portfolio. Our KOAXXA SMA product e...
Validation of Quasi-Analytical and Statistica...
Because today's high-speed, high-density backplane and I/O interconnects are pushing speeds well beyond 10 Gbps, accurate simulation of such system...