Solutions for Causal Modeling and A Technique for Measuring Causal, Broadband Dielectric Properties
This paper addresses specific dielectric and conductor material relationships necessary to produce consistently causal and accurate electrical component models. The need for causal component models is highlighted by showing the types of digital waveforms that can result from simulating structures non-causally.
A brief discussion of causal relationships that must be maintained between dielectric conductance and capacitance as well as conductor resistance and inductance is given.
Download this whitepaper to learn more.
Read More
By submitting this form you agree to TE Connectivity contacting you with marketing-related emails or by telephone. You may unsubscribe at any time. TE Connectivity web sites and communications are subject to their Privacy Notice.
By requesting this resource you agree to our terms of use. All data is protected by our Privacy Notice. If you have any further questions please email dataprotection@techpublishhub.com
Related Categories: Components, Connectors
More resources from TE Connectivity
Validation of Quasi-Analytical and Statistical Simulation Techniques for Multi-Gigabit Interconnect Channels
Because today's high-speed, high-density backplane and I/O interconnects are pushing speeds well beyond 10 Gbps, accurate simulation of such system...
Improving Appliance Connector Designs
TE Connectivity's new POWER TRIPLE LOCK (PTL) connector solution directly responds to the appliance industry's desire for increased reliability and...
Application of Full-wave 3D Field Solvers to Predict EMI Behavior in SFP Cages
This paper presents an investigation into the usage of modeling techniques to predict and improve the shielding effectiveness of rectangular, metal...
