Processors
Key Considerations for Powertrain HIL Test
Safety, availability, and cost considerations can make performing thorough tests of embedded control...
Enabling Next Generation High Density Power Conversion
The drive to create Metadata processing server systems plus the parallel push for increased port density...
MEMS Timing-Keeper Extends Standby Life of Mobile Devices
With increasingly sophisticated Smartphones and mobile devices offering more features and un-tethered...
Factorized Power Architecture and VI BRICKs
As electronic systems continue to trend toward lower voltages with higher currents and as the speed of...
OPTIMIZATION AND OVERHEAD
The intention of this paper is to analyze the overhead of memory used, while employing a C compiler as...
Wall-Mount Rack Solutions for PCI Compliance
Credit, debit and ATM card fraud costs consumers, merchants and financial institutions billions in losses...
eGaN® FETs in High Frequency Resonant Converters
In this white paper eGaN FET technology is applied in a high frequency resonant converter. Previously,...
Pre-tested System-on-Chip Design Accelerates PLD Development
Many moderate size Programmable Logic Device (PLD) designs, especially those in control plane applications,...
ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS
This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced...
ECC vs. Non-ECC MEMORY
Viking Technology manufactures DRAM modules for OEMs in Enterprise, Telecommunications and Industrial...
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