Processors
Computer-on-Module: selecting the right form factor and processor
When it comes to Computer-on-Module (COM) solutions for embedded computing applications, selecting the...
Enabling Next Generation High Density Power Conversion
The drive to create Metadata processing server systems plus the parallel push for increased port density...
Using Non-transparent Bridging in PCI Express Systems
PCI was originally designed as an interconnect for personal computers,because of the nature of PCs at...
PRACTICAL LOW POWER CPLD DESIGN
Any engineer involved with portable or handheld products knows that minimizing power consumption is an...
350V to12V DC “Yeaman Topology” Power System
This paper introduces a new DC/DC power supply architecture, called “Yeaman Topology”. The main characteristic...
Factorized Power Architecture and VI BRICKs
As electronic systems continue to trend toward lower voltages with higher currents and as the speed of...
Top 5 Applications for Inductive Sensors on Packaging Machines
Amid the multitude of advanced technologies being integrated into automated packaging operations today,...
XMOS Technology Whitepaper
Designers for electronic products are challenged by requests for customized and differentiated complex...
eGaN® FETs in High Frequency Resonant Converters
In this white paper eGaN FET technology is applied in a high frequency resonant converter. Previously,...
Key Considerations for Powertrain HIL Test
Safety, availability, and cost considerations can make performing thorough tests of embedded control...
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