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ENHANCED BOILING HEAT TRANSFER BY SUBMERGED ULTRASONIC VIBRATIONS
This paper describes a new two-phase cooling heat transfer cell based on a submerged vibration-induced...
Time Domain Scans Vs. Stepped Frequency Scans
Rohde and Schwarz launched with the RandS ESU the world's first commercial EMI test receiver capable...
Smart Sensors: Enabling the intelligent IoT
Engineers working on systems built using Internet of Things (IoT) technologies now have access to a huge...
Implementing Video Display Interfaces Using MachXO2 PLDs
Lattice Semiconductor has developed a display interface in the MachXO2 PLD family. Because this interface...
Flash Corruption: Software Bug or Supply Voltage Fault?
Flash memory is commonly used to store firmware in embedded systems. Occasionally, the firmware stored...
An Overview of Motion Processing Solutions for Consumer Products
This paper discusses the usage of common sensor types and how sensors can be effectively combined in...
Computer-on-Module: selecting the right form factor and processor
When it comes to Computer-on-Module (COM) solutions for embedded computing applications, selecting the...
Keep Accurate Track of Time and Temperature while Saving Power
When you think of temperature monitoring and critical components survey on a PCBA you may not think of...
TruST25 Digital signature Authenticity with ST25 NFC/RFID tags
Discover how NFC/RFID tags with an embedded digital signature eliminate the risk of counterfeit and gray...
White Paper 1: The Need for Security
With the recent rise of the Internet of Things (IoT), 14 billion devices are now connected. However,...
HIGH RELIABILITY MEMORY MODULE FEATURES, APPLICATIONS & ENVIRONMENTS
Viking Technology manufactures DRAM modules for OEMs in Enterprise, Telecommunications and Industrial...
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