Components
Presented at DesignCon 2009
When designing links, SI engineers often begin with a specific connector platform and then modify system...
DEVELOPMENT OF HIGH-PERFORMANCE, HIGH-VOLUME CONSUMER MEMS GYROSCOPES
This paper discusses the challenges and success factors for creating the world's first integrated MEMS...
Thermal Design and Application of Sixteenth Brick Converters
With the introduction of the Sixteenth Brick converter, the first question some may ask is why would...
Ultra Low Noise Amplifiers
This white paper describes the performance and characteristics of two new ultra low noise LNAs from Skyworks....
Modern Motor Control Applications and Trends
This paper reviews the state of the art of electric drives technology in three specific areas (a) technical...
Input Systems: Intuitive use makes all the difference
Machines simplify our everyday life in many different ways. But for this to work smoothly and for the...
ENHANCING LONG-TERM RELIABILITY WITH COPPER LEADFRAMES
One of the points to consider when selecting a semiconductor device is the package reliability, relative...
HIGH RELIABILITY MEMORY MODULE FEATURES, APPLICATIONS & ENVIRONMENTS
Viking Technology manufactures DRAM modules for OEMs in Enterprise, Telecommunications and Industrial...
CMOS to MIPI D-PHY Interface Bridge Soft IP
MIPI D-PHY is a practical PHY for typical camera and display applications. It is designed to replace...
Optimise beamforming: From bits to RF beams
Radar, satellite communications and 5G NR use AAS with phased array antennas for beamforming. Hybrid...
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