Latest resources from TE Connectivity

Application of Full-wave 3D Field Solvers to ...
This paper presents an investigation into the usage of modeling techniques to predict and improve the shielding effectiveness of rectangular, metal...

KOAXXA SMA RF Interconnects Innovation & Tech...
This white paper presents a technical overview of TE Connectivity's (TE) new KOAXXA SMA RF interconnect product portfolio. Our KOAXXA SMA product e...

Solutions for Causal Modeling and A Technique...
This paper addresses specific dielectric and conductor material relationships necessary to produce consistently causal and accurate electrical comp...