Thermal Management Design Resources for Vicor ChiP Products
Two key factors in maximizing power converter performance and successful power system design are thermal environment and heat management. Power densities are increasing faster than power converter efficiency,thus increased performance from thermal management solutions is required.
Products based on Vicor's new ChiP packaging technology are optimized for both electrical and thermal performance.
Download this whitepaper for more information.
Read More
By submitting this form you agree to Vicor Corporation contacting you with marketing-related emails or by telephone. You may unsubscribe at any time. Vicor Corporation web sites and communications are subject to their Privacy Notice.
By requesting this resource you agree to our terms of use. All data is protected by our Privacy Notice. If you have any further questions please email dataprotection@techpublishhub.com
Related Categories: Components, cooling, Power, Power modules, Power semiconductors, Semiconductors
More resources from Vicor Corporation
Enabling Next Generation High Density Power Conversion
The drive to create Metadata processing server systems plus the parallel push for increased port density and triple-play (voice / video / internet)...
Factorized Power Architecture and V•I Chips
As electronic systems continue to trend toward lower voltages with higher currents and as the speed of contemporary loads continues to increase, th...
Reduce Load Capacitance in Noise-Sensitive, High-Transient Applications, through Implementation of Active Filtering
The following white paper uses a typical off-the-shelf isolated DC-DC converter to demonstrate how an active filter will not only provide superior ...