Automotive
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DEVELOPMENT OF HIGH-PERFORMANCE, HIGH-VOLUME CONSUMER MEMS GYROSCOPES
This paper discusses the challenges and success factors for creating the world's first integrated MEMS...
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5G NR‑V2X For Enhanced Automotive Communications
This white paper provides a technology deep dive into the architecture, protocols and physical layer...
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Thermal Management for Surface-Mount Devices
The origins of the ambient derating curve go back decades to when the U.S. military specified the performance...
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Accumold overview
These micro molding guidelines reflect some of the capabilities we have been asked for and are intended...
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IoT Demands New Approach to MCU-based Embedded Designs
As an industry-leading manufacturer of MCUs, Renesas offers developers some natural advantages such as...
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A NEW APPROACH TO PFC INRUSH PROTECTION
There are currently two common approaches to PFC inrush current protection. Such protection caters only...
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Skyworks De-embedded Scattering Parameters
An integral part of modern RF/microwave circuit design is circuit simulation and evaluation in which...
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Choosing a Fan That Best Fits Your Application
To meet the consumer's ever-increasing demand for faster, more advanced technology, design engineers...
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ENHANCING LONG-TERM RELIABILITY WITH COPPER LEADFRAMES
One of the points to consider when selecting a semiconductor device is the package reliability, relative...
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Ball vs. Sleeve: A Comparison In Bearing Performance
As consumers demand smaller, faster computer systems, OEM design engineers race to create systems with...
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